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Thermal Interface Materials are specially treated high performance silicone elastomers. They are embedded with thermal conductive particles, creating a conforming filler for the gaps between thermal transfer surfaces, such as between microprocessors and heat sinks. Below is a glance of our Thermal Interface Materials:
GP-IP pads are ideal for applications where thermal conductive, electrical insulating, and strong mechanical properties are required.
Designed to replace conventional thermal pads, these jellies save assembly time and reduce labor costs. Ultra soft and highly compressible properties protect force-sensitive components.
Can accurately place beads as small as 0.25 mm high. Through vigorous testing and rapid prototyping, we work with customers to overcome any accuracy challenge.
Multi-layer forming technology helps to get the balance of performance and handling while enabling engineers in design flexibility.
GP-IP pads are designed for applications where thermal conductive, electrical insulative, and strong mechanical properties are required.