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THERMAL INTERFACE
MATERIALS

Performance first.

Thermal Interface Materials are specially treated high performance silicone elastomers. They are embedded with thermal conductive particles, creating a conforming filler for the gaps between thermal transfer surfaces, such as between microprocessors and heat sinks. Below is a glance of our Thermal Interface Materials:

Thermally
Conductive Pad

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Three different softness options provide the highest conformability under lower compression force. Tacky on both sides reduces contact thermal resistance.

Thermally
Conductive
High Voltage
Insulative Pad

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GP-IP pads are ideal for applications where thermal conductive, electrical insulating, and strong mechanical properties are required.

Thermally
Conductive
Dispensable Silicone
Jelly

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Designed to replace conventional thermal pads, these jellies save assembly time and reduce labor costs. Ultra soft and highly compressible properties protect force-sensitive components.

Thermally Conductive Pads

Can accurately place beads as small as 0.25 mm high. Through vigorous testing and rapid prototyping, we work with customers to overcome any accuracy challenge.

Multi-layer forming technology helps to get the balance of performance and handling while enabling engineers in design flexibility.

Thermally Conductive
High Voltage Insulative Pad

GP-IP pads are designed for applications where thermal conductive, electrical insulative, and strong mechanical properties are required.

  • Performance up to 5W/m-K
  • Fiberglass reinforcement improves mechanical strength and enhances the resistance of puncture, cut-through and tear

Thermally Conductive
Dispensable Silicone Jelly

GPF Tjelly materials are designed to replace conventional thermal pads for saving assembly time and labor cost. Ultra soft and highly compressible properties can protect force-sensitive components.
  • Pre-cured jelly, no mixing and curing needed
  • Auto-dispensable for high volume applications
  • Low compression force