Check out the TennMax RF Absorber Sheets. Available from design to cutting in all locations. Learn More

EMI & ENVIRONMENTAL SHIELDING

FORM-IN-PLACE (FIP)
DISPENSED GASKET

As versatile as they come.

One of our bestsellers – through rapid prototyping, our team designs FIP gaskets that reduce the amount and the size of screw holes to achieve smaller overall packaging. In addition, our FIP can be placed on PCB traces as thin as 0.5mm, creating more space for board components.

EMI SHIELDING
CONDUCTIVE FIP
GASKET

Lean more >

Filled with Nickel/Graphite, Ag/Cu, Ag/Al, Ag/Ni or other conductive particles, providing excellent electrical conductivity.

SPECIALIZED FIP
GASKET

Lean more >

Unique conductive gasketing materials for specialty applications:

ULTRA-SOFT
ENVIRONMENTAL FIP
GASKET

Lean more >

Silicone and fluorosilicone Form-in-Place gaskets designed for protection up to an IP68 rating.

PRECISION IS OUR TOP PRIORITY –

Micro-Dispensing Technology

Can accurately place beads as small as 0.25 mm high. Through vigorous testing and rapid prototyping, we work with customers to overcome any accuracy challenge.

Best-In-Class Shielding Solutions

Our shielding solutions are consistently tested with outstanding results.

Let’s get down to the details.

A MUST-HAVE TO COMBAT HARSH ENVIRONMENTS

FLUOROSILICONE FIP

A specialty gasket engineered for aerospace, satellite, land and sea-based applications. Flurosilicone is a superior alternative with all the benefits of silicone and designed for harsh corrosive environments, including exposure to:
  • Salt fog
  • UV and ozone
  • JP-10 jet fuel
  • Polar solvent
  • Polyalphaolefin (PAO)
  • Meets NASA outgassing requirements:
    TML,0.06%
    CVCM,0.01%
    WVR,0.03%

ISO 9001 and AS 9100 Certified. ITAR Registered.
Cybersecurity Maturity Model Certification (CMMC) / SP NIST 800-171 Compliant. Learn More →

GOOD THINGS COME IN TWO’S

MAXCOMBO FIP MATERIALS

Ever want the best of both worlds?
Our specialty MaxCombo™ family is designed to do just that.

MaxEEC™

Environmental Seal + Electrically Conductive FIP
A single gasket that provides both functions, thus provides additional space-saving and weight reduction.

MaxTEC™

Thermally & Electrically Conductive FIP
Increases heat transfer and allows for more efficient conductivity while providing RF shielding between cavities.
ISO 9001 and AS 9100 Certified. ITAR Registered.
Cybersecurity Maturity Model Certification (CMMC) / SP NIST 800-171 Compliant. Learn More →

Articles on Form-In-Place Gaskets

Discover the latest innovations, trends, and insights in form-in-place-gaskets. Stay up-to-date with expert knowledge and industry developments!

Featured

When you need more than just EMI shielding— Maximizing Performance with Combo Form-In-Place Gaskets

As electronic systems shrink and grow more power-dense, engineers must manage EMI, heat, and environmental protection within the same enclosure. Relying on multiple single-function materials increases complexity, assembly time, and space usage.

Fluorosilicone Form-In-Place (FIP) Gaskets: A High-Performance Sealing Solution for Harsh Environments

As electronic systems grow smaller and face harsher conditions, the demand for durable, chemically resistant gaskets continues to rise. Fluorosilicone-based Form-In-Place (FIP) gaskets meet this challenge with exceptional chemical and thermal performance, making them ideal for mission-critical applications.

Innovative Solutions Powering the Future of Aerospace

Aerospace technology demands exceptional performance, reliability, and safety. As the industry faces increasing challenges, materials must evolve to meet these needs.

GET DOWN TO THE DETAILS

Click on any part number to view the data sheet.
Typical PropertiesEMI SHIELDING GASKETSENVIRONMENTAL SEALING GASKETSEMI SPECIALTY GASKETS
Part NumberF5304F5314F5321F6003F6081F7101 MaxTEC™ F5381 Chemical ResistanceF5382 Chemical ResistanceF9304
MaxEEC™
Elastomer BinderSiliconeFluorosiliconeSiliconeFluorosiliconeSilicone
Conductive FillerNi/GrN/ASpecial FillersNi/Gr
Curing SystemThermalThermalThermal
Hardness (Shore A)303570404060607535
Resistance *
(Ohm)
0.080.10.090.100.090.120.150.060.06
Shielding EffectivenessN/A > 100 dB @ 200 Mhz - 40 GHz
Minumum Bead Height0.3 mm0.3 mm0.5 mm0.3 mm1 mm0.3 mm
FeaturesUltrasoft, low compression force applicationSoft, reboundable, low compression force application for higher frequenciesPreferred material for metalized plastics, RTV version of F5301UV ResistantResistance to polar solvents, fuels, chemicals, and salt spray/fog with low outgassingOver 2 times the thermal conductivity of standard FIP EMI gasketsResistance to polar solvents, fuels, oil additives, chemicals, and salt spray/fog with low outgassingExcellent EMI shielding performance with superior environmental sealing property
* DC-through Resistance at 30% compression & 1mm height (Ohm)

Technical FAQ

Here are a few commonly asked engineering and application questions about FIP gaskets and fluorosilicone materials:

What is a form in place (FIP) gasket?

A form‑in‑place gasket is a liquid elastomer dispensed directly onto a component’s surface—then cured into a precise seal—creating both environmental and EMI protection without manual gasket placement.

Why use fluorosilicone in FIP gaskets?

Fluorosilicone combines silicone’s wide temperature range with enhanced fuel, oil, and solvent resistance, making it ideal for aerospace, satellite, and harsh-environment applications.

What are the advantages of fluorosilicone FIP?

It offers superior chemical resistance (e.g., JP‑10 jet fuel, solvents, salt fog), meets NASA outgassing standards, and cures into durable, machine‑dispensed seals with minimal waste.

Can FIP gaskets be conductive for EMI shielding?

Yes. By mixing conductive fillers—such as silver, nickel, graphite, or copper—into the base material, FIP gaskets can achieve over 100 dB EMI shielding across 200 MHz to 12 GHz.

How are FIP gaskets applied and cured?

Precision robotics (jet valves or XYZ dispensing) deposit a bead along the sealing groove. Then they’re cured—by heat, moisture, or UV—directly on the part, eliminating the need for dies or manual installation.