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We provide custom designs for thermal management in the early stage of product development.
Using thermal software simulation we can design heat sinks with embedded heat pipes or water cooling cold plates.
Our one-stop solution offers rapid prototyping to complete turnkey production.
Ideal for electronic products that have higher working environment requirements. Widely used in PCs, phones, testing equipment, and medical devices for its high heat dissipation capacity and reliability.
Other examples:
communication equipment, PAs, military devices, avionics, and energy storage equipment.
For electronic products that have ultra-high heat dissipation, high power consumption, and ultra-low temperature requirements. These products require very stable working conditions, especially in industrial electronic products, such as EVs, electric transportation, cloud workstations/servers, large medical equipments, high-power PAs, electric vehicle control systems, and autonomous driving.
The combination of fins of different processes and Al/copper spreader/HP/VC will have different heat dissipation capabilities and effects. Selecting the suitable fins according to different heat dissipation needs will provide greater design freedom for the heat dissipation of your electronic products.
Without multiple reviews or revised prototypes,
your product development process can be streamlined,
thus saving on time and cost.